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Area Micro-electromechanical systems (MEMS) / Bonding and assembling technology

IEV ref 523-06-07

en
wafer level packaging
process to complete packaging before dicing the wafer

[SOURCE: IEC 62047-1:2016, 2.6.10]


fr
encapsulation au niveau de la tranche, f
procédé prévu pour compléter l’encapsulation avant le découpage en dés de la tranche

[SOURCE: IEC 62047-1:2016, 2.6.10]


de
Wafer-Level-Packaging, n

ja
ウエハレベルパッケージング

pl
obudowywanie na poziomie płytki, n
umieszczanie obudowy ochronnej na strukturach płytki, n

pt
empacotamento ao nível da bolacha
empacotamento ao nível da wafer

zh
圆片级封装

Publication date: 2018-12
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