International
Electrotechnical
Commission
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Area
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
/ Materials for Surface Acoustic Wave (SAW) devices
IEV ref
561-07-09
en
diameter of wafer
diameter of circular portion of wafer excluding the orientation flat and secondary flat regions
fr
diamètre de la plaquette
, m
diamètre de la partie circulaire de la plaquette, à l’exclusion des zones du plan d’orientation et du plan secondaire
ar
قطرالرقاقة
de
Waferdurchmesser, m
es
diámetro de agua
it
diametro della fetta
ko
웨이퍼 직경
ja
ウェハの直径
pl
średnica płytki, f
pt
diâmetro da bolacha
zh
晶片直径
Publication date:
2014-11
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