International

Electrotechnical

Area		Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection / Materials for Surface Acoustic Wave (SAW) devices

IEV ref		561-07-09


en		diameter of wafer
		diameter of circular portion of wafer excluding the orientation flat and secondary flat regions


fr		diamètre de la plaquette, m
		diamètre de la partie circulaire de la plaquette, à l’exclusion des zones du plan d’orientation et du plan secondaire


ar		قطرالرقاقة


de		Waferdurchmesser, m



es		diámetro de agua


it		diametro della fetta

ko		웨이퍼 직경

ja		ウェハの直径


pl		średnica płytki, f

pt		diâmetro da bolacha





zh		晶片直径

Publication date: 2014-11