IEC - Common Data Dictionary (CDD)

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	DET CLASSIFICATION
Code:	A55
Title:	manufacturing process and technology
Properties:	0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD119 - backside finish 0112/2///61360_4#AAD126 - underfill 0112/2///61360_4#AAD155 - MPD delivery form 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAE006 - mounting features 0112/2///61360_4#AAE031 - electrode technology 0112/2///61360_4#AAE262 - encapsulation technology 0112/2///61360_4#AAE364 - gate type 0112/2///61360_4#AAE401 - transistor technology 0112/2///61360_4#AAE489 - diode technology 0112/2///61360_4#AAE531 - primary electrochemical system 0112/2///61360_4#AAE532 - secondary electrochemical system 0112/2///61360_4#AAE638 - transistor polarity 0112/2///61360_4#AAE686 - IC technology 0112/2///61360_4#AAE969 - amplifier package 0112/2///61360_4#AAE973 - FET-technology 0112/2///61360_4#AAF235 - virginity state 0112/2///61360_4#AAF249 - cable/wire 0112/2///61360_4#AAJ009 - structure 0112/2///61360_4#AAJ036 - active element 0112/2///61360_4#AAJ037 - termination style 0112/2///61360_4#AAJ038 - coupling style 0112/2///61360_4#AAJ051 - electrolyte type 0112/2///61360_4#AAJ052 - anode type 0112/2///61360_4#AAJ071 - additional features 0112/2///61360_4#AAJ072 - sealing 0112/2///61360_4#AAJ116 - printed circuit type 0112/2///61360_4#AAJ117 - microwave component type 0112/2///61360_4#AAJ118 - connection type 0112/2///61360_4#AAJ123 - potentiometer type 0112/2///61360_4#AFD114 - integrated circuit process technology

	CLASSIFICATION DET
Code:	A55
Titre:
Propri�t�s:	0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD119 - backside finish 0112/2///61360_4#AAD126 - underfill 0112/2///61360_4#AAD155 - MPD delivery form 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAE006 - mounting features 0112/2///61360_4#AAE031 - electrode technology 0112/2///61360_4#AAE262 - encapsulation technology 0112/2///61360_4#AAE364 - gate type 0112/2///61360_4#AAE401 - transistor technology 0112/2///61360_4#AAE489 - diode technology 0112/2///61360_4#AAE531 - primary electrochemical system 0112/2///61360_4#AAE532 - secondary electrochemical system 0112/2///61360_4#AAE638 - transistor polarity 0112/2///61360_4#AAE686 - IC technology 0112/2///61360_4#AAE969 - amplifier package 0112/2///61360_4#AAE973 - FET-technology 0112/2///61360_4#AAF235 - virginity state 0112/2///61360_4#AAF249 - cable/wire 0112/2///61360_4#AAJ009 - structure 0112/2///61360_4#AAJ036 - active element 0112/2///61360_4#AAJ037 - termination style 0112/2///61360_4#AAJ038 - coupling style 0112/2///61360_4#AAJ051 - electrolyte type 0112/2///61360_4#AAJ052 - anode type 0112/2///61360_4#AAJ071 - additional features 0112/2///61360_4#AAJ072 - sealing 0112/2///61360_4#AAJ116 - printed circuit type 0112/2///61360_4#AAJ117 - microwave component type 0112/2///61360_4#AAJ118 - connection type 0112/2///61360_4#AAJ123 - potentiometer type 0112/2///61360_4#AFD114 - integrated circuit process technology

	TYPKLASSE
Code:	A55
Titel:
Merkmale:	0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD119 - backside finish 0112/2///61360_4#AAD126 - underfill 0112/2///61360_4#AAD155 - MPD delivery form 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAE006 - mounting features 0112/2///61360_4#AAE031 - electrode technology 0112/2///61360_4#AAE262 - encapsulation technology 0112/2///61360_4#AAE364 - gate type 0112/2///61360_4#AAE401 - transistor technology 0112/2///61360_4#AAE489 - diode technology 0112/2///61360_4#AAE531 - primary electrochemical system 0112/2///61360_4#AAE532 - secondary electrochemical system 0112/2///61360_4#AAE638 - transistor polarity 0112/2///61360_4#AAE686 - IC technology 0112/2///61360_4#AAE969 - amplifier package 0112/2///61360_4#AAE973 - FET-technology 0112/2///61360_4#AAF235 - virginity state 0112/2///61360_4#AAF249 - cable/wire 0112/2///61360_4#AAJ009 - structure 0112/2///61360_4#AAJ036 - active element 0112/2///61360_4#AAJ037 - termination style 0112/2///61360_4#AAJ038 - coupling style 0112/2///61360_4#AAJ051 - electrolyte type 0112/2///61360_4#AAJ052 - anode type 0112/2///61360_4#AAJ071 - additional features 0112/2///61360_4#AAJ072 - sealing 0112/2///61360_4#AAJ116 - printed circuit type 0112/2///61360_4#AAJ117 - microwave component type 0112/2///61360_4#AAJ118 - connection type 0112/2///61360_4#AAJ123 - potentiometer type 0112/2///61360_4#AFD114 - integrated circuit process technology

	プロパティ分類
識別コード:	A55
タイトル:
プロパティ:	0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD119 - backside finish 0112/2///61360_4#AAD126 - underfill 0112/2///61360_4#AAD155 - MPD delivery form 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAE006 - mounting features 0112/2///61360_4#AAE031 - electrode technology 0112/2///61360_4#AAE262 - encapsulation technology 0112/2///61360_4#AAE364 - gate type 0112/2///61360_4#AAE401 - transistor technology 0112/2///61360_4#AAE489 - diode technology 0112/2///61360_4#AAE531 - primary electrochemical system 0112/2///61360_4#AAE532 - secondary electrochemical system 0112/2///61360_4#AAE638 - transistor polarity 0112/2///61360_4#AAE686 - IC technology 0112/2///61360_4#AAE969 - amplifier package 0112/2///61360_4#AAE973 - FET-technology 0112/2///61360_4#AAF235 - virginity state 0112/2///61360_4#AAF249 - cable/wire 0112/2///61360_4#AAJ009 - structure 0112/2///61360_4#AAJ036 - active element 0112/2///61360_4#AAJ037 - termination style 0112/2///61360_4#AAJ038 - coupling style 0112/2///61360_4#AAJ051 - electrolyte type 0112/2///61360_4#AAJ052 - anode type 0112/2///61360_4#AAJ071 - additional features 0112/2///61360_4#AAJ072 - sealing 0112/2///61360_4#AAJ116 - printed circuit type 0112/2///61360_4#AAJ117 - microwave component type 0112/2///61360_4#AAJ118 - connection type 0112/2///61360_4#AAJ123 - potentiometer type 0112/2///61360_4#AFD114 - integrated circuit process technology

	DET CLASSIFICATION
代码:	A55
Title:
特性:	0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD119 - backside finish 0112/2///61360_4#AAD126 - underfill 0112/2///61360_4#AAD155 - MPD delivery form 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAE006 - mounting features 0112/2///61360_4#AAE031 - electrode technology 0112/2///61360_4#AAE262 - encapsulation technology 0112/2///61360_4#AAE364 - gate type 0112/2///61360_4#AAE401 - transistor technology 0112/2///61360_4#AAE489 - diode technology 0112/2///61360_4#AAE531 - primary electrochemical system 0112/2///61360_4#AAE532 - secondary electrochemical system 0112/2///61360_4#AAE638 - transistor polarity 0112/2///61360_4#AAE686 - IC technology 0112/2///61360_4#AAE969 - amplifier package 0112/2///61360_4#AAE973 - FET-technology 0112/2///61360_4#AAF235 - virginity state 0112/2///61360_4#AAF249 - cable/wire 0112/2///61360_4#AAJ009 - structure 0112/2///61360_4#AAJ036 - active element 0112/2///61360_4#AAJ037 - termination style 0112/2///61360_4#AAJ038 - coupling style 0112/2///61360_4#AAJ051 - electrolyte type 0112/2///61360_4#AAJ052 - anode type 0112/2///61360_4#AAJ071 - additional features 0112/2///61360_4#AAJ072 - sealing 0112/2///61360_4#AAJ116 - printed circuit type 0112/2///61360_4#AAJ117 - microwave component type 0112/2///61360_4#AAJ118 - connection type 0112/2///61360_4#AAJ123 - potentiometer type 0112/2///61360_4#AFD114 - integrated circuit process technology

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