IEC - Common Data Dictionary (CDD)

	CLASS
Code:	0112/2///61360_4#AAA296
Version:	001 (Superseded version or revision)
Revision:	03
IRDI:	0112/2///61360_4#AAA296#001
Preferred name:	bumped die
Synonymous name:
Coded name:
Short name:	BUMP
Definition:	unpackaged die or wafer that has had added bumps for interconnection and/or mechanical attachment
Note:	Typically these can be die that have had solder or other metallic bumps added to the metallised pads on the die (also known as flip-chip).
Remark:
Definition source:
Drawing:
Class type:	ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
Superclass:	0112/2///61360_4#AAA302
Higher level classes:	0112/2///61360_4#AAA301 - geometry 0112/2///61360_4#AAA000 - electric/electronic components
Classifying DET:
Properties:
Properties tree: Open all \| Close all
Inherited properties: Inherited properties:	0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code ..... 0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code 0112/2///61360_4#AAD009 - die yield 0112/2///61360_4#AAD010 - die description 0112/2///61360_4#AAD011 - wafer size 0112/2///61360_4#AAD019 - signal name 0112/2///61360_4#AAD020 - signal type 0112/2///61360_4#AAD021 - electrical reference 0112/2///61360_4#AAD022 - signal direction 0112/2///61360_4#AAD023 - swap codes 0112/2///61360_4#AAD031 - supply variability 0112/2///61360_4#AAD032 - supply voltage 0112/2///61360_4#AAD033 - pad supply current 0112/2///61360_4#AAD049 - supply name 0112/2///61360_4#AAD054 - supply current 0112/2///61360_4#AAD055 - supply packing code 0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD060 - test procedure description 0112/2///61360_4#AAD070 - die step dimension x 0112/2///61360_4#AAD071 - die step dimension y 0112/2///61360_4#AAD072 - die thickness 0112/2///61360_4#AAD082 - test name 0112/2///61360_4#AAD085 - die type 0112/2///61360_4#AAD086 - die type description 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD089 - supply packing 0112/2///61360_4#AAD090 - supply packing description 0112/2///61360_4#AAD095 - die yield code 0112/2///61360_4#AAD117 - size tolerance 0112/2///61360_4#AAD118 - thickness tolerance 0112/2///61360_4#AAD127 - die picture 0112/2///61360_4#AAD129 - die centre x-position 0112/2///61360_4#AAD130 - die centre y-position 0112/2///61360_4#AAD131 - defect rate 0112/2///61360_4#AAD132 - test flow 0112/2///61360_4#AAD133 - temperature specification 0112/2///61360_4#AAD134 - process options 0112/2///61360_4#AAD137 - conformity level 0112/2///61360_4#AAD140 - die manufacturer 0112/2///61360_4#AAD141 - die supplier 0112/2///61360_4#AAD142 - die data source 0112/2///61360_4#AAD143 - packaged part name 0112/2///61360_4#AAD144 - geometric view 0112/2///61360_4#AAD145 - terminal count 0112/2///61360_4#AAD151 - power limit 0112/2///61360_4#AAD153 - test reliability code 0112/2///61360_4#AAD154 - test maturity code 0112/2///61360_4#AAD156 - fiducial name 0112/2///61360_4#AAD157 - fiducial file name 0112/2///61360_4#AAD158 - fiducial width 0112/2///61360_4#AAD159 - fiducial height 0112/2///61360_4#AAD160 - fiducial x position 0112/2///61360_4#AAD161 - fiducial y position 0112/2///61360_4#AAD162 - fiducial orientation 0112/2///61360_4#AAD163 - die step size x 0112/2///61360_4#AAD164 - die step size y 0112/2///61360_4#AAD165 - wafer gross die count 0112/2///61360_4#AAD166 - wafer index type 0112/2///61360_4#AAD167 - wafer index orientation 0112/2///61360_4#AAD168 - reticule step size x 0112/2///61360_4#AAD169 - reticule step size y 0112/2///61360_4#AAD170 - reticule gross die count 0112/2///61360_4#AAD175 - function 0112/2///61360_4#AAD176 - metallisation 0112/2///61360_4#AAD177 - maximum assembly temperature 0112/2///61360_4#AAD178 - maximum temperature time 0112/2///61360_4#AAD179 - simulator model file 0112/2///61360_4#AAD180 - simulator model file date 0112/2///61360_4#AAD181 - simulator name 0112/2///61360_4#AAD182 - simulator version 0112/2///61360_4#AAD183 - simulator compliance 0112/2///61360_4#AAD184 - simulator applicability 0112/2///61360_4#AAD185 - wafer thickness 0112/2///61360_4#AAD186 - wafer thickness tolerance 0112/2///61360_4#AAD187 - wafer map 0112/2///61360_4#AAD188 - bump shape 0112/2///61360_4#AAD189 - bump drawing 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD191 - number of terminals 0112/2///61360_4#AAD192 - terminal position 0112/2///61360_4#AAD193 - terminal shape and size 0112/2///61360_4#AAD194 - device length 0112/2///61360_4#AAD195 - device width 0112/2///61360_4#AAD196 - moisture sensitivity level 0112/2///61360_4#AAD199 - outline drawing 0112/2///61360_4#AAD200 - outgoing quality level 0112/2///61360_4#AAD201 - quality level units 0112/2///61360_4#AAD202 - outgoing quality description 0112/2///61360_4#AAD203 - electrical parameters specified 0112/2///61360_4#AAD204 - standards compliance 0112/2///61360_4#AAD205 - additional screening 0112/2///61360_4#AAD206 - product status 0112/2///61360_4#AAD207 - testability features 0112/2///61360_4#AAD208 - additional test requirements 0112/2///61360_4#AAD209 - reliability 0112/2///61360_4#AAD210 - reliability units 0112/2///61360_4#AAD211 - reliability conditions 0112/2///61360_4#AAD212 - reliability calculation 0112/2///61360_4#AAD213 - reliability reference 0112/2///61360_4#AAD214 - storage conditions 0112/2///61360_4#AAD215 - long-term storage 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAG000 - geometry type
SuperBlocks:
Is case of:
Imported properties:
Instance sharable:
Status level:	Superseded
Is deprecated:
Published in:	IEC 61360-4
Published by:	IEC
Proposal date:	2015-01-20
Version initiation date:	2010-11-11
Version release date:	2010-11-11
Revision release date:	2015-01-20
Obsolete date:
Responsible Committee:	SC3D
Change request ID:	C00035
Version history: Version history:	001-04 (2023-04-17 09:58:33 by BATCH 00001245) standard

	CLASSE
Code:	0112/2///61360_4#AAA296
Version:	001
R�vision:	03
IRDI:	0112/2///61360_4#AAA296#001
Nom pr�f�r�:
Nom synonyme:
Nom cod�:
Nom court:
D�finition:
Note:
Remarque:
Traducteur:
Version de traduction:
Date de traduction:
Source de d�finition:
Dessin:
Class type:	ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
Superclasse:	0112/2///61360_4#AAA302
Classes sup�rieures:	0112/2///61360_4#AAA301 - geometry 0112/2///61360_4#AAA000 - electric/electronic components
DET de classification:
Propri�t�s:
Propri�t�s: Open all \| Close all
Propri�t�s h�rit�es: Propri�t�s h�rit�es:	0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code ..... 0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code 0112/2///61360_4#AAD009 - die yield 0112/2///61360_4#AAD010 - die description 0112/2///61360_4#AAD011 - wafer size 0112/2///61360_4#AAD019 - signal name 0112/2///61360_4#AAD020 - signal type 0112/2///61360_4#AAD021 - electrical reference 0112/2///61360_4#AAD022 - signal direction 0112/2///61360_4#AAD023 - swap codes 0112/2///61360_4#AAD031 - supply variability 0112/2///61360_4#AAD032 - supply voltage 0112/2///61360_4#AAD033 - pad supply current 0112/2///61360_4#AAD049 - supply name 0112/2///61360_4#AAD054 - supply current 0112/2///61360_4#AAD055 - supply packing code 0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD060 - test procedure description 0112/2///61360_4#AAD070 - die step dimension x 0112/2///61360_4#AAD071 - die step dimension y 0112/2///61360_4#AAD072 - die thickness 0112/2///61360_4#AAD082 - test name 0112/2///61360_4#AAD085 - die type 0112/2///61360_4#AAD086 - die type description 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD089 - supply packing 0112/2///61360_4#AAD090 - supply packing description 0112/2///61360_4#AAD095 - die yield code 0112/2///61360_4#AAD117 - size tolerance 0112/2///61360_4#AAD118 - thickness tolerance 0112/2///61360_4#AAD127 - die picture 0112/2///61360_4#AAD129 - die centre x-position 0112/2///61360_4#AAD130 - die centre y-position 0112/2///61360_4#AAD131 - defect rate 0112/2///61360_4#AAD132 - test flow 0112/2///61360_4#AAD133 - temperature specification 0112/2///61360_4#AAD134 - process options 0112/2///61360_4#AAD137 - conformity level 0112/2///61360_4#AAD140 - die manufacturer 0112/2///61360_4#AAD141 - die supplier 0112/2///61360_4#AAD142 - die data source 0112/2///61360_4#AAD143 - packaged part name 0112/2///61360_4#AAD144 - geometric view 0112/2///61360_4#AAD145 - terminal count 0112/2///61360_4#AAD151 - power limit 0112/2///61360_4#AAD153 - test reliability code 0112/2///61360_4#AAD154 - test maturity code 0112/2///61360_4#AAD156 - fiducial name 0112/2///61360_4#AAD157 - fiducial file name 0112/2///61360_4#AAD158 - fiducial width 0112/2///61360_4#AAD159 - fiducial height 0112/2///61360_4#AAD160 - fiducial x position 0112/2///61360_4#AAD161 - fiducial y position 0112/2///61360_4#AAD162 - fiducial orientation 0112/2///61360_4#AAD163 - die step size x 0112/2///61360_4#AAD164 - die step size y 0112/2///61360_4#AAD165 - wafer gross die count 0112/2///61360_4#AAD166 - wafer index type 0112/2///61360_4#AAD167 - wafer index orientation 0112/2///61360_4#AAD168 - reticule step size x 0112/2///61360_4#AAD169 - reticule step size y 0112/2///61360_4#AAD170 - reticule gross die count 0112/2///61360_4#AAD175 - function 0112/2///61360_4#AAD176 - metallisation 0112/2///61360_4#AAD177 - maximum assembly temperature 0112/2///61360_4#AAD178 - maximum temperature time 0112/2///61360_4#AAD179 - simulator model file 0112/2///61360_4#AAD180 - simulator model file date 0112/2///61360_4#AAD181 - simulator name 0112/2///61360_4#AAD182 - simulator version 0112/2///61360_4#AAD183 - simulator compliance 0112/2///61360_4#AAD184 - simulator applicability 0112/2///61360_4#AAD185 - wafer thickness 0112/2///61360_4#AAD186 - wafer thickness tolerance 0112/2///61360_4#AAD187 - wafer map 0112/2///61360_4#AAD188 - bump shape 0112/2///61360_4#AAD189 - bump drawing 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD191 - number of terminals 0112/2///61360_4#AAD192 - terminal position 0112/2///61360_4#AAD193 - terminal shape and size 0112/2///61360_4#AAD194 - device length 0112/2///61360_4#AAD195 - device width 0112/2///61360_4#AAD196 - moisture sensitivity level 0112/2///61360_4#AAD199 - outline drawing 0112/2///61360_4#AAD200 - outgoing quality level 0112/2///61360_4#AAD201 - quality level units 0112/2///61360_4#AAD202 - outgoing quality description 0112/2///61360_4#AAD203 - electrical parameters specified 0112/2///61360_4#AAD204 - standards compliance 0112/2///61360_4#AAD205 - additional screening 0112/2///61360_4#AAD206 - product status 0112/2///61360_4#AAD207 - testability features 0112/2///61360_4#AAD208 - additional test requirements 0112/2///61360_4#AAD209 - reliability 0112/2///61360_4#AAD210 - reliability units 0112/2///61360_4#AAD211 - reliability conditions 0112/2///61360_4#AAD212 - reliability calculation 0112/2///61360_4#AAD213 - reliability reference 0112/2///61360_4#AAD214 - storage conditions 0112/2///61360_4#AAD215 - long-term storage 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAG000 - geometry type
Is case of:
Imported properties:
Instance sharable:
Statut:	Remplac�
Is deprecated:
Publi� dans:	IEC 61360-4
Publi� par:	IEC
Date de proposition:	2015-01-20
Version, date d'initialisation:	2010-11-11
Version, date de publication:	2010-11-11
Revision release date:	2015-01-20
Date d'obsolescence:
Responsible Committee:	SC3D
Change request ID:	C00035
Historique: Historique:	001-04 (2023-04-17 09:58:33 by BATCH 00001245) standard

	KLASSE
Code:	0112/2///61360_4#AAA296
Version:	001
Revision:	03
IRDI:	0112/2///61360_4#AAA296#001
Bevorzugter Name:
Synonym:
Code:
Kurzbezeichnung:
Definition:
Notiz:
Bemerkung:
�bersetzer:
�bersetzung, Revision:
�bersetzung, Revisionsdatum:
Quelle der Definition:
Zeichnung:
Class type:	ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
Oberbegriff:	0112/2///61360_4#AAA302
�bergeordnete Klassen:	0112/2///61360_4#AAA301 - geometry 0112/2///61360_4#AAA000 - electric/electronic components
Klassifizierendes Datenelement:
Merkmale:
Merkmale: Open all \| Close all
�bernommene Merkmale: �bernommene Merkmale:	0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code ..... 0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code 0112/2///61360_4#AAD009 - die yield 0112/2///61360_4#AAD010 - die description 0112/2///61360_4#AAD011 - wafer size 0112/2///61360_4#AAD019 - signal name 0112/2///61360_4#AAD020 - signal type 0112/2///61360_4#AAD021 - electrical reference 0112/2///61360_4#AAD022 - signal direction 0112/2///61360_4#AAD023 - swap codes 0112/2///61360_4#AAD031 - supply variability 0112/2///61360_4#AAD032 - supply voltage 0112/2///61360_4#AAD033 - pad supply current 0112/2///61360_4#AAD049 - supply name 0112/2///61360_4#AAD054 - supply current 0112/2///61360_4#AAD055 - supply packing code 0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD060 - test procedure description 0112/2///61360_4#AAD070 - die step dimension x 0112/2///61360_4#AAD071 - die step dimension y 0112/2///61360_4#AAD072 - die thickness 0112/2///61360_4#AAD082 - test name 0112/2///61360_4#AAD085 - die type 0112/2///61360_4#AAD086 - die type description 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD089 - supply packing 0112/2///61360_4#AAD090 - supply packing description 0112/2///61360_4#AAD095 - die yield code 0112/2///61360_4#AAD117 - size tolerance 0112/2///61360_4#AAD118 - thickness tolerance 0112/2///61360_4#AAD127 - die picture 0112/2///61360_4#AAD129 - die centre x-position 0112/2///61360_4#AAD130 - die centre y-position 0112/2///61360_4#AAD131 - defect rate 0112/2///61360_4#AAD132 - test flow 0112/2///61360_4#AAD133 - temperature specification 0112/2///61360_4#AAD134 - process options 0112/2///61360_4#AAD137 - conformity level 0112/2///61360_4#AAD140 - die manufacturer 0112/2///61360_4#AAD141 - die supplier 0112/2///61360_4#AAD142 - die data source 0112/2///61360_4#AAD143 - packaged part name 0112/2///61360_4#AAD144 - geometric view 0112/2///61360_4#AAD145 - terminal count 0112/2///61360_4#AAD151 - power limit 0112/2///61360_4#AAD153 - test reliability code 0112/2///61360_4#AAD154 - test maturity code 0112/2///61360_4#AAD156 - fiducial name 0112/2///61360_4#AAD157 - fiducial file name 0112/2///61360_4#AAD158 - fiducial width 0112/2///61360_4#AAD159 - fiducial height 0112/2///61360_4#AAD160 - fiducial x position 0112/2///61360_4#AAD161 - fiducial y position 0112/2///61360_4#AAD162 - fiducial orientation 0112/2///61360_4#AAD163 - die step size x 0112/2///61360_4#AAD164 - die step size y 0112/2///61360_4#AAD165 - wafer gross die count 0112/2///61360_4#AAD166 - wafer index type 0112/2///61360_4#AAD167 - wafer index orientation 0112/2///61360_4#AAD168 - reticule step size x 0112/2///61360_4#AAD169 - reticule step size y 0112/2///61360_4#AAD170 - reticule gross die count 0112/2///61360_4#AAD175 - function 0112/2///61360_4#AAD176 - metallisation 0112/2///61360_4#AAD177 - maximum assembly temperature 0112/2///61360_4#AAD178 - maximum temperature time 0112/2///61360_4#AAD179 - simulator model file 0112/2///61360_4#AAD180 - simulator model file date 0112/2///61360_4#AAD181 - simulator name 0112/2///61360_4#AAD182 - simulator version 0112/2///61360_4#AAD183 - simulator compliance 0112/2///61360_4#AAD184 - simulator applicability 0112/2///61360_4#AAD185 - wafer thickness 0112/2///61360_4#AAD186 - wafer thickness tolerance 0112/2///61360_4#AAD187 - wafer map 0112/2///61360_4#AAD188 - bump shape 0112/2///61360_4#AAD189 - bump drawing 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD191 - number of terminals 0112/2///61360_4#AAD192 - terminal position 0112/2///61360_4#AAD193 - terminal shape and size 0112/2///61360_4#AAD194 - device length 0112/2///61360_4#AAD195 - device width 0112/2///61360_4#AAD196 - moisture sensitivity level 0112/2///61360_4#AAD199 - outline drawing 0112/2///61360_4#AAD200 - outgoing quality level 0112/2///61360_4#AAD201 - quality level units 0112/2///61360_4#AAD202 - outgoing quality description 0112/2///61360_4#AAD203 - electrical parameters specified 0112/2///61360_4#AAD204 - standards compliance 0112/2///61360_4#AAD205 - additional screening 0112/2///61360_4#AAD206 - product status 0112/2///61360_4#AAD207 - testability features 0112/2///61360_4#AAD208 - additional test requirements 0112/2///61360_4#AAD209 - reliability 0112/2///61360_4#AAD210 - reliability units 0112/2///61360_4#AAD211 - reliability conditions 0112/2///61360_4#AAD212 - reliability calculation 0112/2///61360_4#AAD213 - reliability reference 0112/2///61360_4#AAD214 - storage conditions 0112/2///61360_4#AAD215 - long-term storage 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAG000 - geometry type
Is case of:
Imported properties:
Instance sharable:
Status:	Superseded
Is deprecated:
Ver�ffentlicht in:	IEC 61360-4
Ver�ffentlicht von:	IEC
Datum des Vorschlags:	2015-01-20
Version, Veranlassungsdatum:	2010-11-11
Version, Freigabedatum:	2010-11-11
Revision release date:	2015-01-20
Gestrichen seit:
Responsible Committee:	SC3D
Change request ID:	C00035
Historie: Historie:	001-04 (2023-04-17 09:58:33 by BATCH 00001245) standard

	分類（クラス）
識別コード:	0112/2///61360_4#AAA296
改訂版:	001
修正刷:	03
IRDI:	0112/2///61360_4#AAA296#001
推奨名:
別名:
コード化された名称:
略称:
定義:
注記:
備考:
翻訳者:
翻訳第　m 版:
翻訳版発行日:
定義出典:
図:
Class type:	ITEM_CLASS
Applicable documents:
Class value assignment:
Requisity of properties:
上位分類:	0112/2///61360_4#AAA302
上位クラス:	0112/2///61360_4#AAA301 - geometry 0112/2///61360_4#AAA000 - electric/electronic components
分類プロパティ:
プロパティ:
プロパティ: Open all \| Close all
継承プロパティ: 継承プロパティ:	0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code ..... 0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code 0112/2///61360_4#AAD009 - die yield 0112/2///61360_4#AAD010 - die description 0112/2///61360_4#AAD011 - wafer size 0112/2///61360_4#AAD019 - signal name 0112/2///61360_4#AAD020 - signal type 0112/2///61360_4#AAD021 - electrical reference 0112/2///61360_4#AAD022 - signal direction 0112/2///61360_4#AAD023 - swap codes 0112/2///61360_4#AAD031 - supply variability 0112/2///61360_4#AAD032 - supply voltage 0112/2///61360_4#AAD033 - pad supply current 0112/2///61360_4#AAD049 - supply name 0112/2///61360_4#AAD054 - supply current 0112/2///61360_4#AAD055 - supply packing code 0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD060 - test procedure description 0112/2///61360_4#AAD070 - die step dimension x 0112/2///61360_4#AAD071 - die step dimension y 0112/2///61360_4#AAD072 - die thickness 0112/2///61360_4#AAD082 - test name 0112/2///61360_4#AAD085 - die type 0112/2///61360_4#AAD086 - die type description 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD089 - supply packing 0112/2///61360_4#AAD090 - supply packing description 0112/2///61360_4#AAD095 - die yield code 0112/2///61360_4#AAD117 - size tolerance 0112/2///61360_4#AAD118 - thickness tolerance 0112/2///61360_4#AAD127 - die picture 0112/2///61360_4#AAD129 - die centre x-position 0112/2///61360_4#AAD130 - die centre y-position 0112/2///61360_4#AAD131 - defect rate 0112/2///61360_4#AAD132 - test flow 0112/2///61360_4#AAD133 - temperature specification 0112/2///61360_4#AAD134 - process options 0112/2///61360_4#AAD137 - conformity level 0112/2///61360_4#AAD140 - die manufacturer 0112/2///61360_4#AAD141 - die supplier 0112/2///61360_4#AAD142 - die data source 0112/2///61360_4#AAD143 - packaged part name 0112/2///61360_4#AAD144 - geometric view 0112/2///61360_4#AAD145 - terminal count 0112/2///61360_4#AAD151 - power limit 0112/2///61360_4#AAD153 - test reliability code 0112/2///61360_4#AAD154 - test maturity code 0112/2///61360_4#AAD156 - fiducial name 0112/2///61360_4#AAD157 - fiducial file name 0112/2///61360_4#AAD158 - fiducial width 0112/2///61360_4#AAD159 - fiducial height 0112/2///61360_4#AAD160 - fiducial x position 0112/2///61360_4#AAD161 - fiducial y position 0112/2///61360_4#AAD162 - fiducial orientation 0112/2///61360_4#AAD163 - die step size x 0112/2///61360_4#AAD164 - die step size y 0112/2///61360_4#AAD165 - wafer gross die count 0112/2///61360_4#AAD166 - wafer index type 0112/2///61360_4#AAD167 - wafer index orientation 0112/2///61360_4#AAD168 - reticule step size x 0112/2///61360_4#AAD169 - reticule step size y 0112/2///61360_4#AAD170 - reticule gross die count 0112/2///61360_4#AAD175 - function 0112/2///61360_4#AAD176 - metallisation 0112/2///61360_4#AAD177 - maximum assembly temperature 0112/2///61360_4#AAD178 - maximum temperature time 0112/2///61360_4#AAD179 - simulator model file 0112/2///61360_4#AAD180 - simulator model file date 0112/2///61360_4#AAD181 - simulator name 0112/2///61360_4#AAD182 - simulator version 0112/2///61360_4#AAD183 - simulator compliance 0112/2///61360_4#AAD184 - simulator applicability 0112/2///61360_4#AAD185 - wafer thickness 0112/2///61360_4#AAD186 - wafer thickness tolerance 0112/2///61360_4#AAD187 - wafer map 0112/2///61360_4#AAD188 - bump shape 0112/2///61360_4#AAD189 - bump drawing 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD191 - number of terminals 0112/2///61360_4#AAD192 - terminal position 0112/2///61360_4#AAD193 - terminal shape and size 0112/2///61360_4#AAD194 - device length 0112/2///61360_4#AAD195 - device width 0112/2///61360_4#AAD196 - moisture sensitivity level 0112/2///61360_4#AAD199 - outline drawing 0112/2///61360_4#AAD200 - outgoing quality level 0112/2///61360_4#AAD201 - quality level units 0112/2///61360_4#AAD202 - outgoing quality description 0112/2///61360_4#AAD203 - electrical parameters specified 0112/2///61360_4#AAD204 - standards compliance 0112/2///61360_4#AAD205 - additional screening 0112/2///61360_4#AAD206 - product status 0112/2///61360_4#AAD207 - testability features 0112/2///61360_4#AAD208 - additional test requirements 0112/2///61360_4#AAD209 - reliability 0112/2///61360_4#AAD210 - reliability units 0112/2///61360_4#AAD211 - reliability conditions 0112/2///61360_4#AAD212 - reliability calculation 0112/2///61360_4#AAD213 - reliability reference 0112/2///61360_4#AAD214 - storage conditions 0112/2///61360_4#AAD215 - long-term storage 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAG000 - geometry type
Is case of:
Imported properties:
Instance sharable:
状態:	取って代わら
Is deprecated:
公開:	IEC 61360-4
公開者:	IEC
提案日時:	2015-01-20
初版作成日:	2010-11-11
改訂版公開日:	2010-11-11
Revision release date:	2015-01-20
廃用期日:
Responsible Committee:	SC3D
Change request ID:	C00035
版改訂履歴: 版改訂履歴:	001-04 (2023-04-17 09:58:33 by BATCH 00001245) standard

	类
代码:	0112/2///61360_4#AAA296
版本号:	001
修订号:	03
IRDI:	0112/2///61360_4#AAA296#001
推荐名:
同义名:
代码名:
短名:
定义:
注释:
备注:
Translator (to be translated in Chinese):
Translation revison (to be translated in Chinese):
Translation revision date (to be translated in Chinese):
定义来源:
图:
类类型:	ITEM_CLASS
适用文档:
Class value assignment:
特性的必要性:
超类:	0112/2///61360_4#AAA302
上层类:	0112/2///61360_4#AAA301 - geometry 0112/2///61360_4#AAA000 - electric/electronic components
分类DET:
特性:
特性树: Open all \| Close all
Inherited properties: Inherited properties:	0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code ..... 0112/2///61360_4#AAD001 - die identifier 0112/2///61360_4#AAD002 - die name 0112/2///61360_4#AAD003 - die version 0112/2///61360_4#AAD004 - die type code 0112/2///61360_4#AAD008 - die test level code 0112/2///61360_4#AAD009 - die yield 0112/2///61360_4#AAD010 - die description 0112/2///61360_4#AAD011 - wafer size 0112/2///61360_4#AAD019 - signal name 0112/2///61360_4#AAD020 - signal type 0112/2///61360_4#AAD021 - electrical reference 0112/2///61360_4#AAD022 - signal direction 0112/2///61360_4#AAD023 - swap codes 0112/2///61360_4#AAD031 - supply variability 0112/2///61360_4#AAD032 - supply voltage 0112/2///61360_4#AAD033 - pad supply current 0112/2///61360_4#AAD049 - supply name 0112/2///61360_4#AAD054 - supply current 0112/2///61360_4#AAD055 - supply packing code 0112/2///61360_4#AAD056 - supply form code 0112/2///61360_4#AAD060 - test procedure description 0112/2///61360_4#AAD070 - die step dimension x 0112/2///61360_4#AAD071 - die step dimension y 0112/2///61360_4#AAD072 - die thickness 0112/2///61360_4#AAD082 - test name 0112/2///61360_4#AAD085 - die type 0112/2///61360_4#AAD086 - die type description 0112/2///61360_4#AAD087 - supply form 0112/2///61360_4#AAD088 - supply form description 0112/2///61360_4#AAD089 - supply packing 0112/2///61360_4#AAD090 - supply packing description 0112/2///61360_4#AAD095 - die yield code 0112/2///61360_4#AAD117 - size tolerance 0112/2///61360_4#AAD118 - thickness tolerance 0112/2///61360_4#AAD127 - die picture 0112/2///61360_4#AAD129 - die centre x-position 0112/2///61360_4#AAD130 - die centre y-position 0112/2///61360_4#AAD131 - defect rate 0112/2///61360_4#AAD132 - test flow 0112/2///61360_4#AAD133 - temperature specification 0112/2///61360_4#AAD134 - process options 0112/2///61360_4#AAD137 - conformity level 0112/2///61360_4#AAD140 - die manufacturer 0112/2///61360_4#AAD141 - die supplier 0112/2///61360_4#AAD142 - die data source 0112/2///61360_4#AAD143 - packaged part name 0112/2///61360_4#AAD144 - geometric view 0112/2///61360_4#AAD145 - terminal count 0112/2///61360_4#AAD151 - power limit 0112/2///61360_4#AAD153 - test reliability code 0112/2///61360_4#AAD154 - test maturity code 0112/2///61360_4#AAD156 - fiducial name 0112/2///61360_4#AAD157 - fiducial file name 0112/2///61360_4#AAD158 - fiducial width 0112/2///61360_4#AAD159 - fiducial height 0112/2///61360_4#AAD160 - fiducial x position 0112/2///61360_4#AAD161 - fiducial y position 0112/2///61360_4#AAD162 - fiducial orientation 0112/2///61360_4#AAD163 - die step size x 0112/2///61360_4#AAD164 - die step size y 0112/2///61360_4#AAD165 - wafer gross die count 0112/2///61360_4#AAD166 - wafer index type 0112/2///61360_4#AAD167 - wafer index orientation 0112/2///61360_4#AAD168 - reticule step size x 0112/2///61360_4#AAD169 - reticule step size y 0112/2///61360_4#AAD170 - reticule gross die count 0112/2///61360_4#AAD175 - function 0112/2///61360_4#AAD176 - metallisation 0112/2///61360_4#AAD177 - maximum assembly temperature 0112/2///61360_4#AAD178 - maximum temperature time 0112/2///61360_4#AAD179 - simulator model file 0112/2///61360_4#AAD180 - simulator model file date 0112/2///61360_4#AAD181 - simulator name 0112/2///61360_4#AAD182 - simulator version 0112/2///61360_4#AAD183 - simulator compliance 0112/2///61360_4#AAD184 - simulator applicability 0112/2///61360_4#AAD185 - wafer thickness 0112/2///61360_4#AAD186 - wafer thickness tolerance 0112/2///61360_4#AAD187 - wafer map 0112/2///61360_4#AAD188 - bump shape 0112/2///61360_4#AAD189 - bump drawing 0112/2///61360_4#AAD190 - bump attachment method 0112/2///61360_4#AAD191 - number of terminals 0112/2///61360_4#AAD192 - terminal position 0112/2///61360_4#AAD193 - terminal shape and size 0112/2///61360_4#AAD194 - device length 0112/2///61360_4#AAD195 - device width 0112/2///61360_4#AAD196 - moisture sensitivity level 0112/2///61360_4#AAD199 - outline drawing 0112/2///61360_4#AAD200 - outgoing quality level 0112/2///61360_4#AAD201 - quality level units 0112/2///61360_4#AAD202 - outgoing quality description 0112/2///61360_4#AAD203 - electrical parameters specified 0112/2///61360_4#AAD204 - standards compliance 0112/2///61360_4#AAD205 - additional screening 0112/2///61360_4#AAD206 - product status 0112/2///61360_4#AAD207 - testability features 0112/2///61360_4#AAD208 - additional test requirements 0112/2///61360_4#AAD209 - reliability 0112/2///61360_4#AAD210 - reliability units 0112/2///61360_4#AAD211 - reliability conditions 0112/2///61360_4#AAD212 - reliability calculation 0112/2///61360_4#AAD213 - reliability reference 0112/2///61360_4#AAD214 - storage conditions 0112/2///61360_4#AAD215 - long-term storage 0112/2///61360_4#AAD216 - assembly information 0112/2///61360_4#AAD217 - attach methods and materials 0112/2///61360_4#AAD218 - bonding methods and materials 0112/2///61360_4#AAD219 - attachment limitations 0112/2///61360_4#AAD220 - process limitations 0112/2///61360_4#AAD221 - storage limitations 0112/2///61360_4#AAG000 - geometry type
Is case of:
输入特性:
Instance sharable:
状态级别:	Superseded (to be translated)
Is deprecated:
发布:	IEC 61360-4
发布者:	IEC
提议日期:	2015-01-20
版本生成日期:	2010-11-11
版本发布日期:	2010-11-11
修订发布日期:	2015-01-20
废止日期:
负责委员会:	SC3D
变更请求号:	C00035
版本历史: 版本历史:	001-04 (2023-04-17 09:58:33 by BATCH 00001245) standard