Note 1 to entry: Chemical mechanical polishing is applied mainly to planarize steps on a substrate due to the semiconductor manufacturing process. Because the steps are composed of a plurality of materials such as substrates, dielectrics and metals, various slurries are used to remove selectively each material. In micro-electromechanical devices, chemical mechanical polishing is used to planarize the bonding surfaces in the wafer level packaging process.

Note 2 to entry: This note applies to the French language only.