|Definition:|| perpendicularly penetrating electro interconnection between both surfaces of a silicon substrate
Note 1 to entry: Through-silicon-vias are mainly applied to three-dimensionally stacked packaging of semiconductor devices. In the MEMS fields, the through-silicon-vias are applied to wafer level packaging technology. Some through-silicon-vias consist of through-via, insulator and electrode material. Solder, copper, doped-poly-silicon and so on are used as electrode materials.
Note 2 to entry: This note applies to the French language only.