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Area Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection / Materials for Surface Acoustic Wave (SAW) devices

IEV ref 561-07-09

en
diameter of wafer
diameter of the circular portion of a wafer excluding the orientation flat and the secondary flat

fr
diamètre de la plaquette, m
diamètre de la partie circulaire d’une plaquette, à l’exclusion du plat d’orientation et du plat secondaire

ar
قطرالرقاقة

de
Waferdurchmesser, m

es
diámetro de agua

it
diametro della fetta

ko
웨이퍼 직경

ja
ウェハの直径

pl
średnica płytki, f

pt
diâmetro da bolacha

zh
晶片直径

Publication date: 2021-08
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