International

Electrotechnical

Commission

Area: 523: Micro-electromechanical systems (MEMS) Index language:

Section 523-01: General
	523-01-01	MEMS
	523-01-02	MST
	523-01-03	micromachine
Section 523-02: Science and engineering
	523-02-01	scale effect
	523-02-02	microtribology
	523-02-03	electro-wetting on dielectric
	523-02-04	stiction
	523-02-05	hydrophilic, adj
	523-02-06	hydrophobic, adj
Section 523-03: Material science
	523-03-01	maximum force, <in a cycle>
	523-03-02	minimum force, <in a cycle>
	523-03-03	mean force
	523-03-04	maximum displacement
	523-03-05	minimum displacement
	523-03-06	mean displacement
	523-03-07	displacement range
	523-03-08	force ratio
	523-03-09	deflection, <of a test piece>
	523-03-10	deflection angle
	523-03-11	amplitude, <MEMS>
	523-03-12	S-N curve
	523-03-13	failure strength
	523-03-14	instantaneous failure strength
	523-03-15	grid pattern
	523-03-16	residual stress
	523-03-17	curvature
	523-03-18	membrane window
	523-03-19	gauge factor
	523-03-20	elongation at electrical failure
Section 523-04: Functional elements
	523-04-01	biosensor
	523-04-02	integrated microprobe
	523-04-03	ISFET
	523-04-04	microgyroscope
	523-04-05	diaphragm structure
	523-04-06	microcantilever
	523-04-07	microchannel
	523-04-08	microactuator
	523-04-09	light-driven actuator
	523-04-10	piezoelectric actuator
	523-04-11	shape-memory alloy actuator
	523-04-12	comb-drive actuator
	523-04-13	scanning mirror
	523-04-14	optical switch
	523-04-15	microgripper
	523-04-16	micropump
	523-04-17	microvalve
	523-04-18	micro fuel cell
	523-04-19	photoelectric transducer
	523-04-20	silicon-on-insulator
	523-04-21	e-compass
	523-04-22	2-axis e-compass
	523-04-23	3-axis e-compass
	523-04-24	6-axis e-compass
	523-04-25	CMOS MEMS
Section 523-05: Machining technology
	523-05-01	thick film technology
	523-05-02	thin film technology
	523-05-03	bulk micromachining
	523-05-04	surface micromachining
	523-05-05	surface modification
	523-05-06	LIGA process
	523-05-07	laser dicing
	523-05-08	isotropic etching
	523-05-09	anisotropic etching
	523-05-10	etch stop
	523-05-11	sacrificial etching
	523-05-12	reactive ion etching
	523-05-13	deep reactive ion etching
	523-05-14	inductively coupled plasma
	523-05-15	atomic layer deposition
	523-05-16	self-assembled monolayer
	523-05-17	electroforming
	523-05-18	nanoimprint
	523-05-19	micromoulding
	523-05-20	STM machining
Section 523-06: Bonding and assembling technology
	523-06-01	bonding
	523-06-02	anodic bonding
	523-06-03	diffusion bonding
	523-06-04	surface-activated bonding
	523-06-05	silicon fusion bonding
	523-06-06	packaging, <of components>
	523-06-07	wafer level packaging
	523-06-08	through-silicon-via
	523-06-09	adhesive bend strength
	523-06-10	adhesive shear strength
Section 523-07: Measurement technology
	523-07-01	scanning probe microscope
	523-07-02	atomic force microscope
	523-07-03	spectroscopic ellipsometry
	523-07-04	aspect ratio, <MEMS>
Section 523-08: Application technologies
	523-08-01	bio-MEMS
	523-08-02	MOEMS
	523-08-03	power MEMS
	523-08-04	energy harvesting
	523-08-05	lab-on-a-chip
	523-08-06	micro TAS
	523-08-07	microreactor
	523-08-08	fibre endoscope
	523-08-09	bio-chip
	523-08-10	DNA chip
	523-08-11	protein chip
	523-08-12	polymerase chain reaction