| Section 523-01: General |
| 523-01-01 | MEMS | |
| 523-01-02 | MST | |
| 523-01-03 | micromachine | |
| Section 523-02: Science and engineering |
| 523-02-01 | scale effect | |
| 523-02-02 | microtribology | |
| 523-02-03 | electro-wetting on dielectric | |
| 523-02-04 | stiction | |
| 523-02-05 | hydrophilic, adj | |
| 523-02-06 | hydrophobic, adj | |
| Section 523-03: Material science |
| 523-03-01 | maximum force, <in a cycle> | |
| 523-03-02 | minimum force, <in a cycle> | |
| 523-03-03 | mean force | |
| 523-03-04 | maximum displacement | |
| 523-03-05 | minimum displacement | |
| 523-03-06 | mean displacement | |
| 523-03-07 | displacement range | |
| 523-03-08 | force ratio | |
| 523-03-09 | deflection, <of a test piece> | |
| 523-03-10 | deflection angle | |
| 523-03-11 | amplitude, <MEMS> | |
| 523-03-12 | S-N curve | |
| 523-03-13 | failure strength | |
| 523-03-14 | instantaneous failure strength | |
| 523-03-15 | grid pattern | |
| 523-03-16 | residual stress | |
| 523-03-17 | curvature | |
| 523-03-18 | membrane window | |
| 523-03-19 | gauge factor | |
| 523-03-20 | elongation at electrical failure | |
| Section 523-04: Functional elements |
| 523-04-01 | biosensor | |
| 523-04-02 | integrated microprobe | |
| 523-04-03 | ISFET | |
| 523-04-04 | microgyroscope | |
| 523-04-05 | diaphragm structure | |
| 523-04-06 | microcantilever | |
| 523-04-07 | microchannel | |
| 523-04-08 | microactuator | |
| 523-04-09 | light-driven actuator | |
| 523-04-10 | piezoelectric actuator | |
| 523-04-11 | shape-memory alloy actuator | |
| 523-04-12 | comb-drive actuator | |
| 523-04-13 | scanning mirror | |
| 523-04-14 | optical switch | |
| 523-04-15 | microgripper | |
| 523-04-16 | micropump | |
| 523-04-17 | microvalve | |
| 523-04-18 | micro fuel cell | |
| 523-04-19 | photoelectric transducer | |
| 523-04-20 | silicon-on-insulator | |
| 523-04-21 | e-compass | |
| 523-04-22 | 2-axis e-compass | |
| 523-04-23 | 3-axis e-compass | |
| 523-04-24 | 6-axis e-compass | |
| 523-04-25 | CMOS MEMS | |
| Section 523-05: Machining technology |
| 523-05-01 | thick film technology | |
| 523-05-02 | thin film technology | |
| 523-05-03 | bulk micromachining | |
| 523-05-04 | surface micromachining | |
| 523-05-05 | surface modification | |
| 523-05-06 | LIGA process | |
| 523-05-07 | laser dicing | |
| 523-05-08 | isotropic etching | |
| 523-05-09 | anisotropic etching | |
| 523-05-10 | etch stop | |
| 523-05-11 | sacrificial etching | |
| 523-05-12 | reactive ion etching | |
| 523-05-13 | deep reactive ion etching | |
| 523-05-14 | inductively coupled plasma | |
| 523-05-15 | atomic layer deposition | |
| 523-05-16 | self-assembled monolayer | |
| 523-05-17 | electroforming | |
| 523-05-18 | nanoimprint | |
| 523-05-19 | micromoulding | |
| 523-05-20 | STM machining | |
| Section 523-06: Bonding and assembling technology |
| 523-06-01 | bonding | |
| 523-06-02 | anodic bonding | |
| 523-06-03 | diffusion bonding | |
| 523-06-04 | surface-activated bonding | |
| 523-06-05 | silicon fusion bonding | |
| 523-06-06 | packaging, <of components> | |
| 523-06-07 | wafer level packaging | |
| 523-06-08 | through-silicon-via | |
| 523-06-09 | adhesive bend strength | |
| 523-06-10 | adhesive shear strength | |
| Section 523-07: Measurement technology |
| 523-07-01 | scanning probe microscope | |
| 523-07-02 | atomic force microscope | |
| 523-07-03 | spectroscopic ellipsometry | |
| 523-07-04 | aspect ratio, <MEMS> | |
| Section 523-08: Application technologies |
| 523-08-01 | bio-MEMS | |
| 523-08-02 | MOEMS | |
| 523-08-03 | power MEMS | |
| 523-08-04 | energy harvesting | |
| 523-08-05 | lab-on-a-chip | |
| 523-08-06 | micro TAS | |
| 523-08-07 | microreactor | |
| 523-08-08 | fibre endoscope | |
| 523-08-09 | bio-chip | |
| 523-08-10 | DNA chip | |
| 523-08-11 | protein chip | |
| 523-08-12 | polymerase chain reaction | |